| 摘要 |
PROBLEM TO BE SOLVED: To uniformly fill an underfill material. SOLUTION: A manufacturing method of a semiconductor device includes providing the underfill material 40 between a semiconductor chip 10 and a substrate 20. On the substrate 20, a plurality of projections 30 slenderly extended in either direction in a region overlapped to the semiconductor chip 10 are formed. The underfill material 40 is injected from the outside of the semiconductor chip 10 so that the underfill material enters the portion between adjacent projections 30. COPYRIGHT: (C)2004,JPO&NCIPI
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