| 摘要 |
PURPOSE: An IC package carrier is provided to prevent an electromagnetic interference and eliminate the necessity of increasing gaps between conductive wires of a conductor pattern. CONSTITUTION: An IC package carrier comprises a substrate(10); a conductor pattern arranged on the substrate, and which is constituted by a plurality of conductive wires each of which includes a conductive portion having two side surfaces and one top surface; a plurality of conductors(40) arranged on the conductor pattern, wherein each of conductors is disposed on the conductive portion and includes a bottom surface(401) and a top surface(402), and at least part of the bottom surface contacts and is electrically connected to a certain part of the top surface of the opposed conductive portion; and a solder mask(30) arranged on the substrate such that a predetermined portion of the conductor pattern is coated with the solder mask, two side surfaces of the conductive portion are covered with the solder mask, and the top surface of the conductor is coated with the solder mask. The conductor pattern is electrically connected to electronic components mounted on the carrier through the conductors.
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