Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus

摘要

A printed circuit board which has been soldered in a molten solder bath is cooled immediately thereafter with a cooling liquid at a rate of at least 10 DEG C/second. Thermal effects of high-temperature solder during soldering are suppressed, and the metal matrix of the solder is refined, resulting in soldered connection of increased strength. <IMAGE>