SEMICONDUCTOR SENSOR AND PLATING METHOD FOR SEMICONDUCTOR DEVICE

摘要

A method for plating a semiconductor wafer with a plating film of uniform thickness at low cost while preventing the back of the wafer from being plated and preventing the wafer from being contaminated at the later steps. The method is characterized in that when a connection terminal is directly formed on an Al electrode of a semiconductor wafer, electroless plating is conducted while covering the back of the wafer with an insulator. The insulator is preferably a glass substrate which is a constituent component of a product. A semiconductor sensor having, on a semiconductor substrate, an improved corrosion resistance against a corrosive medium is also disclosed. The semiconductor sensor comprises a structure portion and an electricity quantity transducer for sensing a physical quantity or a chemical component of a corrosive medium and a pad portion serving as a lead-out terminal for an electric signal generated. The pad portion is protected with a noble metal.