| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for transferring a thin wafer from a wafer cassette without causing any damage. SOLUTION: A vertically telescopic robot body 5 reads out the position of a containing shelf a wafer 1' of a wafer cassette 2 and the drooping position of the wafer 1' at the central point of the containing shelf by means of the optical sensor 8 of a robot arm 7 and calculates the shape (curved state due to drooping) when the wafer 1' is contained, thus determining the pinching position of the wafer 1'. The robot body 5 takes out the wafer 1' from the lower stage of the wafer cassette 2 by means of a robot hand 6 based on the pinching position thus determined. COPYRIGHT: (C)2004,JPO&NCIPI
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