PLATING APPARATUS AND PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plating apparatus with which a copper plating can sufficiently be applied to a substrate, such as semi-conductor wafer. SOLUTION: This plating apparatus is provided with a wafer treating part for applying the plating treatment on the surface of the semi-conductor wafer by using plating solution, a main component control part for controlling the main component concentration in the plating solution and a minor component control part 3 for controlling the minor components in the plating solution. The minor component control part 3 is provided with an analyzing part 320 for performing a quantitative analyses of the minor components in the plating solution, and a supplemental part 321 for supplementing supplemental liquid containing the prescribed amount of the minor components into the plating solution used for the wafer treating part based on the analyzed result with the analyzing part 320. The analyzing part 320 is provided with a sampling part 319 for sampling the plating solution from the wafer treating part and an analyzing cup 336 for performing the analyses of the plating solution by accomodating the plating solution shifted from the sampling part 319. COPYRIGHT: (C)2004,JPO&NCIPI