ELECTRONIC COMPONENT-BUILT-IN MODULE

摘要

A module comprising an electronic component having at least two electrodes, a substrate having on the surface thereof electrodes respectively connected to the electrodes of the electronic component, solder for respectively connecting the electrodes of the electronic component with the electrodes of the substrate, insulation resin for covering the electronic component, the substrate surface, the solder and the electrodes, and solder resists provided on the surface of the substrate and around respective electrodes on the substrate. One solder resist is separated from another solder resist at least between the electronic component and the substrate. Solder will not flow outside electrodes even if solder inside insulation resin melts when this module is mounted on a mother substrate.