| 摘要 |
PROBLEM TO BE SOLVED: To prevent a video take-in error of an image sensor package. SOLUTION: An Si wafer 1 to which epoxy resin 3 is applied and a cover glass plate 4 are oppositely arranged in a vacuum chamber. The Si wafer 1 is fitted to a pressing board (not illustrated) of a sticking device, and the cover glass plate 4 is stuck to the Si wafer 1 with epoxy resin 3 as adhesive. Air bubbles in epoxy resin 3 are vacuum-deaerated. It is desirable that a vacuum degree in the vacuum chamber is higher for removing the minute air bubbles, but the vacuum degree of the vacuum chamber is desirable to be about 1×10<SP>-3</SP>mBar when a relation of output gas from epoxy resin 3 and throughput is considered. COPYRIGHT: (C)2004,JPO&NCIPI
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