| 摘要 |
<p>A dual component molding assembly for packaging hot melt adhesives wherein a mold (3), preferably in the form of an open top pan, includes a cavity which is lined with a thin film (8) of plastic material. The mold (3) has openings (7) formed therein which communicate with the cavity to facilitate vacuum forming of the film (8) to the cavity's interior surface. The second component is a carrier for the mold (3) and is also preferably in the form of an open top pan (10). The carrier also includes a cavity for receiving the mold (3), and functions not only to support the mold (3) when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold (3). After filling the mold (3) with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer (18) of thin film of plastic material which is then sealed to the first film (8) lining the interior of the mold (3). After cooling, the packaged adhesive is cut adjacent the seal to form individual adhesive blocks for further processing.</p> |
