发明名称 POLISHING METHOD OF PLATE-LIKE MEMBER
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing method for particularly and uniformly polishing a plate-like member such as a thin printed wiring board over the whole surface without damage such as a curve by an easy method, and reducing a dimensional change by thermal deformation of the plate-like member. <P>SOLUTION: When polishing the plate-like member, a back face of a polishing object surface of the plate-like member is adhered to a plane member rigid more than the plate-like member and having at least one opening, and the plate-like member is polished while pressing the plate-like member to the plane member by a polishing member. The plate-like member and the plane member are adhered by using surface tension of liquid without using an adhesive and a tape. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004195607(A) 申请公布日期 2004.07.15
申请号 JP20020368721 申请日期 2002.12.19
申请人 MITSUBISHI PAPER MILLS LTD 发明人 KOMURO TOYOICHI;HYODO KENJI
分类号 B24B7/00;B24B37/30;B24B41/06 主分类号 B24B7/00
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