发明名称 |
POLISHING METHOD OF PLATE-LIKE MEMBER |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method for particularly and uniformly polishing a plate-like member such as a thin printed wiring board over the whole surface without damage such as a curve by an easy method, and reducing a dimensional change by thermal deformation of the plate-like member. <P>SOLUTION: When polishing the plate-like member, a back face of a polishing object surface of the plate-like member is adhered to a plane member rigid more than the plate-like member and having at least one opening, and the plate-like member is polished while pressing the plate-like member to the plane member by a polishing member. The plate-like member and the plane member are adhered by using surface tension of liquid without using an adhesive and a tape. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004195607(A) |
申请公布日期 |
2004.07.15 |
申请号 |
JP20020368721 |
申请日期 |
2002.12.19 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
KOMURO TOYOICHI;HYODO KENJI |
分类号 |
B24B7/00;B24B37/30;B24B41/06 |
主分类号 |
B24B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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