| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg which can reduce or prevent the formation of resin films in a punching process to improve the yield of circuit boards, facilitates the control of humidity at places for storing or producing the prepreg, and can realize high quality punching processing to give the circuit boards having high reliability on the connections of circuits and so on. SOLUTION: The circuit is characterized by containing an epoxy compound having two or more epoxy groups in the molecule and a high ortho phenol- formaldehyde resin having a methyl group ortho position rate of at least >=60% as a curing agent for the epoxy compound in an organic fiber woven or nonwoven fabric substrate. |
