发明名称 |
Method for fabricating a capacitor |
摘要 |
A method for fabricating capacitor capable of simplifying formation processes of ruthenium (Ru) layer for storage node electrode formation of capacitor comprises the steps of: forming a first insulating layer having a first opening exposing a predetermined region on a substrate; forming a conductive plug filled within the first opening; forming a second insulating layer having a second opening exposing the conductive plug on the first insulating layer; forming a conductive layer covering the second opening by sequentially performing PECVD and LPCVD processes on the second insulating layer; exposing the second insulating layer by performing etch back on the conductive layer; forming a storage node electrode of the capacitor by removing the second insulating layer; and forming a dielectric layer to cover the storage node electrode; and forming a plate electrode. In an alternative embodiment, a thermal treatment under an N2 gas supply is performed after the step of forming the conductive layer.
|
申请公布号 |
US6762090(B2) |
申请公布日期 |
2004.07.13 |
申请号 |
US20020067951 |
申请日期 |
2002.02.05 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
AHN BYOUNG KWON;PARK SUNG HOON;KIM JOON HO |
分类号 |
H01L21/8242;H01L21/02;H01L21/336;H01L21/768;H01L27/108;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/8242 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|