发明名称 SOLDERLESS TERMINAL
摘要 PROBLEM TO BE SOLVED: To provide a solderless terminal in which an electric connection state with small and stable contact resistance can be maintained stably over a long term even if a passivating coating film exists on the conductor surface of an electric wire to be crimping connected. SOLUTION: The solderless terminal 11 comes into a state electrically connected to the conductor 13 by caulking a conductor caulking part 22 to the circumference of the conductor 13 of the electric wire 15, and is constituted so that a metal plating layer 26 which has a higher hardness than that of the passivating coating film formed on the surface of the conductor 13, and is superior in conductivity, is installed at an inner surface of the conductor caulking part 22 which at least the conductor 13 contacts with. Therefore, when the conductor caulking part 22 is caulked with the conductor 13 of the electric wire 15, the passivating coating film on the conductor 13 is destroyed by the rigid metal plating layer 26, and such a superior solderless connection state can be obtained that the passivating coating film in which augmentation of contact resistance occurs is not interposed between the solderless terminal 11 and the conductor 13. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004193073(A) 申请公布日期 2004.07.08
申请号 JP20020362789 申请日期 2002.12.13
申请人 YAZAKI CORP 发明人 FUJIMOTO KEI;ONUMA MASANORI
分类号 H01R4/18;H01R13/03;(IPC1-7):H01R13/03 主分类号 H01R4/18
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