| 摘要 |
This invention concerns a method for metal plating plastic substrates, where the plastic surfaces are etched, activated, rinsed, optionally treated with an accelerator, and metal plated by chemical reductive or electrolytic means. In order to provide metal plating of plastic substrates that is simple, cheap, and rapid, yet produce metal platings that are functionally reliable and reproducible, the etching and activation of the plastic substrates in the invention is carried out in a common process step, which takes place in an etch-activation solution containing at least one mineral acid-containing etching agent and an ionic activator. Moreover, a solution is disclosed that is suitable in particular for use with the process of the invention, which is made available for simultaneous etching and activation of active substrates containing one or more etching agents, an etching-active wetting agent, hydrochloric acid and an activator containing noble metal ions.
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