发明名称 Semiconductor devices with enlarged recessed gate electrodes and methods of fabrication therefor
摘要 A semiconductor device includes a semiconductor substrate having a recess therein. A gate insulator is disposed on the substrate in the recess. The device further includes a gate electrode including a first portion on the gate insulator in the recess and a second reduced-width portion extending from the first portion. A source/drain region is disposed in the substrate adjacent the recess. The recess may have a curved shape, e.g., may have hemispherical or ellipsoid shape. The source/drain region may include a lighter-doped portion adjoining the recess. Relate fabrication methods are also discussed.
申请公布号 US2004129959(A1) 申请公布日期 2004.07.08
申请号 US20030738316 申请日期 2003.12.17
申请人 KIM SEONG-HO;LEE CHANG-SUB;CHOE JEONG-DONG;KIM SUNG-MIN;LEE SHIN-AE;PARK DONG-GUN 发明人 KIM SEONG-HO;LEE CHANG-SUB;CHOE JEONG-DONG;KIM SUNG-MIN;LEE SHIN-AE;PARK DONG-GUN
分类号 H01L21/28;H01L21/336;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L21/336;H01L29/76;H01L31/113;H01L21/320;H01L31/062;H01L21/476 主分类号 H01L21/28
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