发明名称 EPOXY RESIN COMPOSITION AND ELECTRICALLY INSULATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having excellent heat resistance, low water absorption, and low dielectric tangent even at a high-frequency of 1 GHz or more, and a low dielectric tangent material composed of a cured product of the resin composition. SOLUTION: The epoxy resin composition is characterized by comprising (A) an epoxy resin represented by formula (1) and (B) an ester of an aromatic polyvalent carboxylic acid and an aromatic hydroxy compound. ( In formula (1), G is a glycidyl group; Q and R are each a halogen atom, a 1-5C alkyl group, or an aryl group, wherein Q and R may be either the same as or different from each other; (n) is an integer of 0-8, and (m) and (p) are each an integer of 0-3.). COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004189985(A) 申请公布日期 2004.07.08
申请号 JP20020362562 申请日期 2002.12.13
申请人 DAINIPPON INK & CHEM INC 发明人 FUJIMOTO KOICHI;KUWANA YASUHIRO;DEMURA SATOSHI
分类号 C08G59/22;C08G59/42;H01B3/40;H01L23/14;(IPC1-7):C08G59/22 主分类号 C08G59/22
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