发明名称 |
Leistungsmodul |
摘要 |
<p>Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface of a heat sink (3) fixed to a support plate (2). A DC capacitor (16) is fixed to a bottom face of the heat sink (3) by adhesion. A control substrate (11) having a control IC (13) mounted thereon is fixed to the support plate (2). Moreover, a plurality of electrodes (10), a DC side electrode and refrigerant inlet-outlet (9) and a control connector (15) are provided on the support plate (2). A case (1) is fixed to a peripheral portion of the support plate (2), and surrounds the insulating substrate (5), the control substrate (11), the heat sink (3) and the DC capacitor 16 together with the support plate (2). Both the case (1) and the support plate (2) have conducting property.</p> |
申请公布号 |
DE10054962(B4) |
申请公布日期 |
2004.07.08 |
申请号 |
DE2000154962 |
申请日期 |
2000.11.06 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO |
发明人 |
FUKADA, MASAKAZU;NAKAJIMA, DAI;TAKANASHI, KEN |
分类号 |
H05K9/00;H01L23/00;H01L23/04;H01L23/06;H01L23/20;H01L23/22;H01L23/44;H01L23/473;H01L25/07;H01L25/18;H05K1/14;H05K7/14;H05K7/20;(IPC1-7):H05K9/00;H05K5/04 |
主分类号 |
H05K9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|