LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A liquid epoxy resin composition for semiconductor package and a semiconductor device packaged with the composition are provided, to improve curing velocity without deterioration of storage for obtaining thermal stress stability, to enhance storage stability and workability and to reduce elastic modulus after curing. CONSTITUTION: The liquid epoxy resin composition comprises 5-20 wt% of a bisphenol-based epoxy resin containing a bisphenol AD epoxy resin represented by the formula 1; an alkylated aryl diamine-based curing agent represented by the formula 2 whose content is determined to make the ratio of epoxy/amine be 1.0/1.0 to 1.2/1.0 by equivalence to the epoxy resin; 0.1-1 wt% of an imidazole slat-based curing accelerator; 0.1-10 wt% of a modified polyolefin-based stress-reducing agent; 0.1-5 wt% of a silane-based coupling agent; and 70-75 wt% of an inorganic filler, wherein R is a methyl, ethyl or propyl group.