LEAD FRAME STRUCTURE IN SEMICONDUCTOR PACKAGE PROCESS

摘要

PURPOSE: A lead frame structure in a semiconductor package process is provided to decrease process time and reduce fabrication cost by omitting a trim process and a plating process. CONSTITUTION: A lead frame structure in a semiconductor package process include a damber and a lead. The damber is entirely coated with an insulator. The lead is connected with the damber. The lead is entirely enclosed with a coating layer(20) made of the insulator. The coating layer is entirely enclosed with a gold print layer(22). The lead includes an inner and outer lead.