TEST METHOD OF WAFER LEVEL SEMICONDUCTOR DEVICE

摘要

PURPOSE: A test method of a wafer level semiconductor device is provided to prevent process failure due to film stress by getting feedback with various process conditions from a correlation between the warpage degree of a wafer and the film stress. CONSTITUTION: A warpage radius(R) is obtained according to a warpage degree(δ) of a wafer(10). A correlation between the warpage degree and film stress is obtained by using the warpage radius. A variety of process conditions for feedback are obtained from the correlation, thereby reducing the film stress.