| 摘要 |
PROBLEM TO BE SOLVED: To enable application of a mark to a failure piece without causing transfer or resin leakage even when the failure mark is automatically applied in an apparatus for applying the failure identification mark to a tape carrier for a semiconductor device. SOLUTION: An apparatus includes an impression punch unit for failure marking. The unit has a flat surface 61 provided at the tip end of a punch 6 and having a diameter larger than that of a hole 71 of a die 7, and also has a projection 9 provided nearly in the center of the flat surface 61 and having such a diameter as to fit into the die hole 71. COPYRIGHT: (C)2004,JPO&NCIPI
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