FLIP-CHIP MOUNTING ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME, CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING PACKAGE

摘要

A method for producing a flip-chip mounting electronic component having a plurality of terminals (3) spotted on the mounting face (1) with a conductor being formed on the terminal (3) in which flip-chip mounting capable of shortening the distance between bumps (7) is realized. A step for covering the mounting face (1) with a conductor of specified thickness, a step for masking the conductor surface at such parts as corresponding to the terminal (3) parts, and a step for removing the conductor except the mask (6) part are carried out in this order. The bump is preferably composed of copper.