发明名称 FLUID FLOW REGULATING VALVE USING THERMAL EXPANSION MATERIAL
摘要 A FLUID FLOW REGULATING VALVE (100) USING A THERMAL EXPANSION MATERIAL (125). THE VALVE INCLUDES A BODY (110) PROVIDED WITH INLET AND OUTLET PORTS (111,112); A DISPLACEMENT CONTROL PART (120) IN THE BODY, THE DISPLACEMENT CONTROL PART CONTAINING THE THERMAL EXPANSION MATERIAL (125) AND DISPLACED TOWARD THE OUTLET PORT (112) WHEN THE THERMAL EXPANSION MATERIAL (125) EXPANDS, THEREBY REGULATING A DEGREE OF OPENING OF THE OUTLET PORT (112); AND A HEATER (131) FOR HEATING THE THERMAL EXPANSION MATERIAL (125) WITHIN THE DISPLACEMENT CONTROL PART. THE DISPLACEMENT CONTROL PART INCLUDES A CONTAINER (121) CONTAINING THE THERMAL EXPANSION MATERIAL (125), THE CONTAINER BEING COUPLED TO THE BODY (110) AND AN EXPANSION PLATE (122) FOR REGULATING THEDEGREE OF OPENING OF THE OUTLET PORT (112) BY BEING EXPANDED IN ACCORDANCE WITH AN EXPANSION OF THE THERMAL EXPANSION MATERIAL (125), THE EXPANSION PLATE (122) BEING HERMETICALLY COUPLED TO THE CONTAINER (121). (FIGURE 2)
申请公布号 MY117376(A) 申请公布日期 2004.06.30
申请号 MYPI9703617 申请日期 1997.08.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH-HYUN BAEK;WOONG-LIN HWANG;JAE-HO MOON
分类号 F16K7/10;F16K31/02;F16K31/64 主分类号 F16K7/10
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