发明名称 Barrier layer for electrical connectors and methods of applying the layer
摘要 A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the group consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, and rhodium. An outer finish layer is coated over the barrier layer, and the finish layer is selected from the group consisting of tin, gold, palladium, platinum, silver, and alloys thereof, so that the electrical contact resistance of the treated contact member does not exceed about 10 milliohms at 100 grams contact force over a period of at least 1000 hours, and at a temperature of at least 150 degrees C.
申请公布号 US6755958(B2) 申请公布日期 2004.06.29
申请号 US20010015500 申请日期 2001.12.11
申请人 HANDY & HARMAN 发明人 DATTA AMIT
分类号 B32B15/04;B32B15/20;C23C28/00;C23C28/02;C25D3/00;C25D3/12;C25D3/56;C25D5/10;C25D5/34;C25D7/00;H01L;H01R13/03;(IPC1-7):C23C28/00 主分类号 B32B15/04
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