| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device whose reflow resistivity is improved, whose semiconductor chip occupancy rate against a package is increased, whose metallic flash is not turned to be any problem, and whose inexpensive substrate is made available. <P>SOLUTION: This semiconductor device is provided with an interposer 11 having an anchor electrode 14 formed by dividing a through-hole plated part 19 whose upper and lower faces are electrically connected into two; a semiconductor chip 12 mounted on the upper face of the interposer 11, and electrically connected through a bonding wire 15 to an anchor electrode 14, and resin 16 for sealing the upper face of the interposer 11, the bonding wire 15 and the semiconductor chip 12. The anchor electrode 15 is configured by closing the lower face side, and filling a recessed part at the upper face side with the resin 16. <P>COPYRIGHT: (C)2004,JPO</p> |
