| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a solder bump small in diameter incapable of being formed heretofore while sufficiently satisfying functions expected for the solder bump, to provide the semiconductor device in which the solder bump reduced in voids and cracks is formed, to provide the semiconductor device in which the solder bump without being peeled from an intermediate metallic layer or a pad is formed, to provide a method of forming the solder bump which can remarkably shorten an operation period of time, and to provide an ink composition for a solder bump formation used therefor. <P>SOLUTION: In the method of producing the solder alloy material, the solder alloy material is dissolved into a supercritical fluid or a subcritical fluid, and then crystals are precipitated. <P>COPYRIGHT: (C)2004,JPO</p> |
