| 发明名称 |
Pattern transfer in device fabrication |
| 摘要 |
A method of transferring a pattern onto a substrate during IC fabrication is disclosed. The substrate is coated with a photosensitive layer having compounds dissolved in a solvent. Roughness on the sidewalls of the photosensitive layer is eliminated or reduced by evaporating the solvent without using elevated temperatures.
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| 申请公布号 |
US2004121264(A1) |
申请公布日期 |
2004.06.24 |
| 申请号 |
US20020065956 |
申请日期 |
2002.12.04 |
| 申请人 |
LIEGL BERNHARD;PREUNINGER JUERGEN;VARNERIN LARRY;WILLIAMS GARY;CARPI ENIO;CHEN XIAOCHUN L. |
发明人 |
LIEGL BERNHARD;PREUNINGER JUERGEN;VARNERIN LARRY;WILLIAMS GARY;CARPI ENIO;CHEN XIAOCHUN L. |
| 分类号 |
G03C5/00;G03F7/00;G03F7/16;G03F7/40;(IPC1-7):G03C5/00 |
主分类号 |
G03C5/00 |
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