| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily realize a multi-pin structure by increasing the size of a mounting face. <P>SOLUTION: A new chip 116 region is determined in a first region 102 having the same constitution as a conventional semiconductor chip and a second region 104 which is the peripheral region on a semiconductor wafer. First and second external terminals 132a and 132b and discrete wiring structures (for example, first and second wiring structures 130a and 130b) are formed on the first and second regions 102 and 104 in order to wire again a plurality of pads 18 for circuit element connection on the first region 102. Passive elements 106 and 108 electrically connected in series are provided on a part of the wiring structure (for example, the second wiring structure 130b) extended on the second region 104 and formed. <P>COPYRIGHT: (C)2004,JPO |
