| 摘要 |
PROBLEM TO BE SOLVED: To provide a wet treatment apparatus which prevents the attachment of fine particles on a semiconductor substrate due to static electricity during a process wherein the semiconductor substrate is dried and rotated, after being subject to a wet treatment. SOLUTION: The wet treatment apparatus comprises a stage 25 to set a silicon substrate 15' on, rotation mechanism 27 for rotating the silicon substrate 15', chamber section 21 which surrounds the stage 25 and the rotation mechanism 27, treatment liquid supply section 23 for supplying chemicals and pure water to the silicon substrate 15', and a means for supplying ions onto a front surface of the silicon substrate 15'. COPYRIGHT: (C)2004,JPO
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