发明名称 CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS
摘要 A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.
申请公布号 US6753218(B2) 申请公布日期 2004.06.22
申请号 US20030375303 申请日期 2003.02.27
申请人 DEVOE DANIEL;DEVOE ALAN;DEVOE LAMBERT;TRINH HUNG 发明人 DEVOE DANIEL;DEVOE ALAN;DEVOE LAMBERT;TRINH HUNG
分类号 H01G4/228;H01G4/232;H05K1/03;H05K1/16;(IPC1-7):H01L21/824 主分类号 H01G4/228
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