发明名称 CONDUCTIVE RESIN COMPOSITION AND ELECTRONIC PART BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin capable of obtaining a high conductivity even having a low filling rate of conductive powder in the coating film of the conductive resin composition, and capable of forming a thin film, and an electronic part by using the same, e.g. a thin solid electrolytic capacitor by using the conductive resin composition as an anode-forming material. SOLUTION: This conductive resin composition contains (A) a conductive powder and carbon nanotube, (B) a thermoplastic resin and (C) an organic solvent, and the conductive powder contains preferably any of≥1 of the powder of silver, copper or silver-plated copper. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004168966(A) 申请公布日期 2004.06.17
申请号 JP20020339160 申请日期 2002.11.22
申请人 HITACHI CHEM CO LTD 发明人 SHIMIZU TAKEHIRO;MATSUURA SHUICHI
分类号 C08L101/00;C08K3/08;C08K5/00;C08K7/00;C08K9/02;C08L77/06;C08L79/08;H01B1/00;H01B1/22;H01B1/24;H01G9/04;(IPC1-7):C08L101/00 主分类号 C08L101/00
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