| 摘要 |
PROBLEM TO BE SOLVED: To reduce size variance in hole size reduction quantity in a process of reducing a resist hole pattern through a heat treatment. SOLUTION: In a process of heating a substrate where a resist pattern is formed, a heat-treatment temperature is set again according to a result T obtained by measuring the temperature of a heat-treating apparatus so that the quantity of variation in pattern size due to a heat treatment reaches a desired value in the middle of the heat treatment. The heating temperature may be set again by blocks 20A, 20B, and 20C by using a heat-treating apparatus 18 comprising the blocks 20A, 20B, and 20C each equipped with a temperature control mechanism. COPYRIGHT: (C)2004,JPO |
