| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing technique capable of reducing the processing time while minimizing the amount of etching for the substrate surface. SOLUTION: A cleaning process for the substrate is taken place by feeding an alkaline processing liquid with an ultrasonic vibration and subsequently feeding an acidic processing liquid to the surface of the rotating substrate. Contaminative particles on the substrate are released from the substrate surface by the ultrasonic vibration of the alkaline processing liquid, and since the electric potentials of the contaminative particles and that of the substrate surface are of the same polarity in the alkaline processing liquid, re-adhesion of the once released contaminative particles is prevented. Therefore, the contaminative particles are efficiently removed. Since metallic contaminants on the substrate surface are changed to hydroxides by the alkaline processing liquid, they are removed by being rapidly dissolved by the subsequent acidic processing liquid. Therefore the processing time is reduced. With this method, the amount of etching for the substrate is minimized, since the metallic contaminants are removed by the acidic processing liquid of weak etching power. COPYRIGHT: (C)2004,JPO
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