发明名称 MULTILAYER WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board wherein transmission loss is reduced effectively. <P>SOLUTION: In the multilayer wiring board equipped with a conductor line as a transmission line wherein the conductor line is sandwiched between conductor layers of two layers which are ground or a power source, characteristic impedance of the transmission line is 35-45Ω, distance between the conductor layers is 200-400μm, and further, line width of at least one transmission line is 100-250μm. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004172484(A) 申请公布日期 2004.06.17
申请号 JP20020338365 申请日期 2002.11.21
申请人 HITACHI CHEM CO LTD 发明人 SHIMADA YASUSHI;KONDO YUSUKE;MADARAME TAKESHI;OTSUKA KAZUHISA;SHIMAYAMA YUICHI;YAMAGUCHI MASANORI;MIZUSHIMA ETSUO;YAMAMOTO KAZUNORI
分类号 H05K3/46;H01L23/12;H01L23/14;(IPC1-7):H05K3/46 主分类号 H05K3/46
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