发明名称 SEMICONDUCTOR PACKAGE LOADING APPARATUS
摘要 PURPOSE: A semiconductor package loading apparatus is provided to privately loading the semiconductor package of a tray to a tube at a low cost. CONSTITUTION: A semiconductor package loading apparatus is provided with an on-loader part(10) for automatically supplying a tray(5), an off-loader part(14) for loading a vacant tray, a tray picker transfer part(26) for transferring the vacant tray to the off-loader part and transferring the tray supplied from the on-loader part, and a tray feeder(42) for loading the tray transferred by the tray picker transfer part. The semiconductor package loading apparatus further includes a tray feeder transfer part(46) having a spin driving part for rotating the tray feeder and a vertical driving part for moving the tray feeder to and fro, a package picker(50) for picking up packages by using a package transfer part, and a tube loading unit(80) for loading the packages to a tube.
申请公布号 KR20040050658(A) 申请公布日期 2004.06.16
申请号 KR20020078522 申请日期 2002.12.10
申请人 HANMISEMICONDUCTOR CO., LTD. 发明人 KIM, JIN CHEON;MUN, CHUN BAE;SHIN, GYEONG HYEON;YANG, HAE CHUN
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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