POWER AMPLIFIER MODULE

摘要

PURPOSE: A power amplifier module is provided to reduce a cost of chip components and a cost required in embedding the chip components and to minimize a size of the chip components. CONSTITUTION: According to the power amplifier module, an input matching part(100) receives a RF signal and a power amplifier part(110) amplifies the RF signal received by the input matching part and an output matching part(120) matches an impedance of the amplified RF signal and then outputs it to the external. Passive elements of the input matching part and the power amplifier part and the output matching part are stacked on a plurality of ceramic boards, and an amplification integrated circuit element of the power amplifier part is embedded on the uppermost layer of the ceramic board. And a metal pattern is formed on a part where the IC element is embedded and on a part corresponding to its bottom layer.