| 摘要 |
PURPOSE: An apparatus for driving a focus ring of a plasma etch chamber is provided to improve the uniformity of a wafer by controlling the height of a focus ring according to each divided portion for applying a variety of process conditions. CONSTITUTION: An apparatus for driving a focus ring of a plasma etch chamber includes a focus ring(34) for holding a wafer loaded on an electrostatic chuck(30). The focus ring is divided into a plurality of portions. The apparatus for driving the focus ring further includes a focus ring driving part(32) installed at the edge portion of the electrostatic chuck for moving at least one out of the divided portions up and down according to a variety of process conditions. Each divided portion is capable of being moved by using a corresponding servo motor.
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