发明名称 |
Method of masking microelectronic semiconductor chips with protective caps |
摘要 |
A method of using protective caps (160) applied to a first side of a wafer (150) in the production of microfabricated devices (152), such as micro-electro-mechanical systems (MEMS) devices. One cap (160) covers each microfabricated device or group respectively, such that a gap remains between adjacent protective caps. One or more etches are applied to the gaps between the caps to remove material and separate the wafer into separate units.
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申请公布号 |
US6750083(B2) |
申请公布日期 |
2004.06.15 |
申请号 |
US20020129499 |
申请日期 |
2002.05.06 |
申请人 |
SILVERBROOK RESEARCH PTY LTD |
发明人 |
SILVERBROOK KIA |
分类号 |
H01L21/301;B29C35/08;B29C43/36;B81B7/00;B81C1/00;H01L21/48;H01L23/02;H01L23/04;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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