| 发明名称 |
Electro-conductive metal plated polyimide substrate |
| 摘要 |
An electro-conductive metal plated polyimide substrate is composed of an aromatic polyimide substrate, a subbing metal layer of Mo-Ni alloy (in which a weight ratio of Mo to Ni is 75/25 to 99/1, and a plated electro-conductive film.
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| 申请公布号 |
US2004110024(A1) |
申请公布日期 |
2004.06.10 |
| 申请号 |
US20030715506 |
申请日期 |
2003.11.19 |
| 申请人 |
UBE INDUSTRIES, LTD. |
发明人 |
KATSUKI SHOZO;MII HIDENORI |
| 分类号 |
B32B7/02;H01L23/14;H01L23/498;H05K1/03;H05K3/38;(IPC1-7):B32B15/08 |
主分类号 |
B32B7/02 |
| 代理机构 |
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