发明名称 Method of molding using compact molding apparatus
摘要 A molding method utilizing a moveable mold platen which may hold, have affixed to, or carry a first portion of a mold or molds. A second or door platen may hold, have affixed to, or carry a second portion of a mold or molds. The door platen is placed in its closed position, and the moveable mold platen is brought up adjacent to it, so that the two portions of the mold are brought into engagement with one another. A desired molding material is injected into the mold cavity, after which the moveable platen is retracted, the door platen is opened, and the part is removed. A part to be encapsulated may be placed into the mold before the two portions of the mold are brought into engagement.
申请公布号 US2004108622(A1) 申请公布日期 2004.06.10
申请号 US20030666151 申请日期 2003.09.18
申请人 GILLEN JOHN H.;ASH CHARLES E.;CLARK JOHN M. 发明人 GILLEN JOHN H.;ASH CHARLES E.;CLARK JOHN M.
分类号 B29C45/64;B29C33/20;B29C33/28;B29C45/00;B29C45/04;B29C45/14;B29C45/68;(IPC1-7):B29C45/64 主分类号 B29C45/64
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