发明名称 Integrated circuit structure with improved LDMOS design
摘要 A semiconductor integrated circuit including an LDMOS device structure comprises a semiconductor layer with a pair of spaced-apart field effect gate structures over an upper surface of the semiconductor layer. First and second spaced-apart source regions of a first conductivity type are formed in a portion of the layer between the pair of gate structures with a first region of a second conductivity type formed there between. A lightly doped body region of a second conductivity type is formed in the semiconductor layer, extending from below the source regions to below the gate structures and extending a variable depth into the semiconductor layer. This body region is characterized by an inflection in depth in that portion of the body region extending below the first region.
申请公布号 US2004108548(A1) 申请公布日期 2004.06.10
申请号 US20020315517 申请日期 2002.12.10
申请人 发明人 CAI JUN
分类号 H01L21/336;H01L29/10;H01L29/45;H01L29/49;H01L29/78;(IPC1-7):H01L29/76;H01L31/062;H01L31/113 主分类号 H01L21/336
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