| 摘要 |
PROBLEM TO BE SOLVED: To provide a hermetic sealing method for preventing a fail from easily occurring in airtight sealing without using any expensive gold and environmentally troubled lead. SOLUTION: In the junction of a seal cover to a semiconductor package; a brazing material that is an Sn/Sb alloy of Sb 3.5-20 mass % is provided on one side in the sealing cover, a metallization layer for sealing cover bonding is provided in the semiconductor package where the metallization layer contains a surface layer made of at least one kind selected from a group comprising Ni, Sn, and Sb, and the side is joined to the surface layer. Or, in the semiconductor package, the metallization layer for sealing cover bonding is provided, where the surface layer of Au of 0.001-0.8μm is provided on an Ni layer. COPYRIGHT: (C)2004,JPO
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