| 摘要 |
PROBLEM TO BE SOLVED: To form bumps formed through electroless plating for example, so as to have a uniform height. SOLUTION: The whole surface of a semiconductor wafer 1 comprises an integrated circuit and an electrode pad 2 electrically connected to the integrated circuit and provided on the surface of a semiconductor substrate 1 (1a), and is covered by an insulating film 3 contacted with at least one part of the electrode pad 2 while an opening unit is provided on the insulating film 3 by removing the insulating film on the electrode pad 2, whereby the bump 6 electrically connected with the electrode pad 2 is formed on the electrode pad 2 by the electroless plating method. COPYRIGHT: (C)2004,JPO
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