发明名称 SEMICONDUCTOR INSPECTING SYSTEM, SEMICONDUCTOR DEFECT ANALYZING SYSTEM, SEMICONDUCTOR DESIGN DATA MODIFYING SYSTEM, SEMICONDUCTOR INSPECTING METHOD, SEMICONDUCTOR DEFECT ANALYZING METHOD, SEMICONDUCTOR DESIGN DATA MODIFYING METHOD, AND COMPUTER READABLE RECORDED MEDIUM
摘要 A semiconductor inspecting system extracts a region to be inspected from a design data of a semiconductor device and divides the region by a lattice to prepare lattice regions; derives a numerical value indicative of a design characteristic of the design data every one of the lattice regions to prepare a design characteristic item data; prepares a characteristic classification data by classifying the design characteristic item data into a desired number of groups; extracts the lattice regions at random from the characteristic classification data at a constant sampling rate; acquires a defect inspection data by actually inspecting a pattern of the extracted lattice regions processed on the basis of the design data; and calculates the number of defects in the whole region to be inspected on the basis of the defect inspection data, the characteristic classification data and the sampling rate.
申请公布号 US6748571(B2) 申请公布日期 2004.06.08
申请号 US20030409205 申请日期 2003.04.09
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MIWA TADASHI
分类号 H01L21/66;G06F17/50;G06T1/00;G06T7/00;G06T7/60;(IPC1-7):G06F17/50 主分类号 H01L21/66
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