| 发明名称 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 摘要 |
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
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| 申请公布号 |
US6747216(B2) |
申请公布日期 |
2004.06.08 |
| 申请号 |
US20020068229 |
申请日期 |
2002.02.04 |
| 申请人 |
INTEL CORPORATION |
发明人 |
BRIST GARY A.;LONG GARY BAXTER;SATO DARYL A. |
| 分类号 |
H05K1/02;H05K3/46;(IPC1-7):H05K1/11;H01R12/04 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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