ATOMIC LAYER DEPOSITION OF HIGH K DIELECTRIC FILMS

摘要

A method of processing a semiconductor substrate includes reacting in a reactor a first reactant gas, evacuating the first reactant gas from the reactor, reacting a second reactant gas, and evacuating the second reactant gas. The reacting of the first reactant gas reacts the first reactant gas with an exposed surface of the semiconductor substrate in a reactor to convert the exposed surface into a solid mono-layer. The reacting of the second reactant gas reacts the second reactant gas with the solid mono-layer in the reactor to convert the solid mono-layer into a gaseous compound. The evacuating of the second reactant gas also evacuates the gaseous compound from the reactor.