| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer supporting device by which traces of supporting pins do not occur on the back surface of a semiconductor wafer. SOLUTION: The semiconductor wafer supporting device comprises a disk-shaped supporting plate 2 on which the semiconductor wafer W is mounted, and a plate supporting base 3 which supports the supporting plate 2. The supporting plate 2 has on its surrounding portion 2a three or more notched grooves 2b which reach the inner side to the outer peripheral surface Wa of the semiconductor wafer W and through which the supporting pins P vertically moving can be partially entered, and the supporting pins P has a taper structure on its front end to hold the end face of the semiconductor wafer. COPYRIGHT: (C)2004,JPO |
