发明名称 |
Apparatus for die bonding |
摘要 |
The present invention provides an apparatus for bonding a semiconductor chip to substrate using a non-conductive adhesive tape. The non-conductive adhesive tape may be a polyimide tape. The apparatus may include a tape provider having a reel on which the non-adhesive tape may be spooled, rollers, and a tape cutter which cuts the tape to a suitable size. A tape holder and a tape presser may also be provided to hold the tape in place while the tape cutter cuts the tape. A tape pick-up tool may be provided to transfer the cut tape to a die bonding area on the substrate. The tape holder and the tape pick-up tool may include a suction opening for providing a suction force. The apparatus may further include a die pick up tool for transferring a semiconductor chip from a semiconductor chip provider to the adhesive tape affixed to the substrate.
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申请公布号 |
US6742561(B2) |
申请公布日期 |
2004.06.01 |
申请号 |
US20020116786 |
申请日期 |
2002.04.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
NAM SHI BAEK;KIM DONG KUK |
分类号 |
H01L21/52;H01L21/50;H01L21/58;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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