Ceramic multilayer substrate and method for manufacturing the same

摘要

Disclosed are a ceramic multilayer substrate in which internal connection parts formed in the internal patterns are broad enough to surround the external terminal, and a method for manufacturing the substrate, thereby stably achieving a connection between the internal patterns and the external terminal and maintaining the connection even in the case of an error occurring in a step for forming a through hole on the substrate. The ceramic multilayer substrate comprises a plurality of ceramic substrates being stacked vertically, each substrate having a designated thickness; pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminals formed on side surfaces of the stacked ceramic substrates; and internal connection parts, each of which is formed on a part of the pattern layer, being connected to the external terminal so as to exchange signals with the outside and being broad enough to surround the external terminal.