| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and the manufacturing method thereof wherein the number of its processes is made small, and its cost is made low easily, and the delivery times of its prototype and its product are made short easily, and further, its selectable base material is not restricted. SOLUTION: A conductor pattern is constituted out of an aggregation promoting layer 2 containing particulates and/or fiber-form substances which is formed on a base material and out of a metal-particulate aggregation layer 1 wherein metal fine particles are aggregated. After forming the aggregation promoting layer in the form of the conductor pattern, a metal-particulate solution containing no binder is so applied onto the patterned aggregation promoting layer and is so dried as to form the patterned metal-particulate aggregation layer. Thereby, the conductor pattern constituted out of the aggregation promoting layer and the metal-particulate aggregation layer is provided. COPYRIGHT: (C)2004,JPO
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